Shimla Mirchi Movie In Hindi 3gp Download
This is the official blog of the Indian Bollywood Film Star Shimla Mirch. You will find more about her here. Aims to achieve professional level music in a short time. She is a great inspiration to me to work hard and dream bigger. She is all-round great artist, a lovely person, a great friend and an absolute love to us.1. Field of the Invention The invention relates to a bonding wire used for connecting a main electrode to a semiconductor chip in a lead frame or a lead-on-chip structure. 2. Description of the Related Art In a semiconductor device using a lead frame or a lead-on-chip structure, a bonding wire is provided between a semiconductor chip and a main electrode (lead) and fixed to the main electrode. The bonding wire is required to be strong enough to resist the strength of an external force applied in the process of wire-bonding. A wire such as an Al (aluminum) wire and a Ti (titanium) wire is generally used for the bonding wire. The Ti wire is often used because the Ti wire is strong enough to withstand the external force. FIG. 12 is a diagram of a semiconductor device using a conventional Al wire. As shown in FIG. 12, a semiconductor chip 12 and a bonding wire 11 are electrically connected to each other by the conventional Al wire 11. In the semiconductor device using the conventional Al wire 11, the Al wire 11 is exposed to the outside from the package. If the external force is applied to the Al wire 11, the Al wire 11 tends to be pulled in the direction of arrow 13. However, the Al wire 11 is not likely to be pulled because the Al wire 11 is pulled by the bonding wire 11. As a result, the Al wire 11 is likely to break. FIG. 13 is a diagram of a semiconductor device using a conventional Ti wire. As shown in FIG. 13, a semiconductor chip 12 and a bonding wire 11 are electrically connected to each other by the conventional Ti wire 11. In the semiconductor device using the conventional Ti wire 11, the Ti wire 11 is covered by a protecting film 18. Thus, the Ti wire 11 is unlikely to be pulled by the bonding wire 11. However, the external force is likely to be applied to the Ti wire 11 because the Ti wire 11 is exposed to the outside from the package. As a result, the Ti wire 11 is likely to break.